Welded piping & vacuum cooling
Orbital-welded assemblies, vacuum cooling products and freeform bent and welded tubing, with supporting hoses, bellows and flanges.
Explore vacuum components →Orbital-welded assemblies, vacuum cooling products and freeform welded tubing. Explore TT Vision F241/F4X wirebond AOI and F2X wafer inspection for your manufacturing process.
AT Merchant Solutions LLC is based in Phoenix, Arizona, with a focus on welded piping, vacuum cooling products and semiconductor inspection equipment. Our product areas connect custom assembly requirements with wafer and wirebond inspection.
From vacuum interfaces to wafer defect detection, a clear specification begins with understanding the application.
Meet your connection partner →Orbital-welded assemblies, vacuum cooling products and freeform bent and welded tubing, with supporting hoses, bellows and flanges.
Explore vacuum components →Core product families: TT Vision F241/F4X wirebond AOI and F2X wafer inspection, including Pro, Pro+ and S3i configurations.
Explore semiconductor equipment →Explore orbital welding, vacuum cooling products and freeform bent and welded assemblies. Share your drawing, interfaces and operating conditions to define the required configuration.

Tube and fitting assemblies, branch lines and manifolds with drawing-defined joints and connection layouts.
Explore orbital-welded assemblies →
Flanged connections, bent tubing, bellows sections and multi-port welded assemblies for vacuum cooling applications.
Explore vacuum cooling products →
Custom spatial routing, return bends, coiled tubing and assemblies combining selected rigid and flexible sections.
Explore custom bent & welded products →Supporting components: hoses, bellows, flanges and dimensional references →
Explore two TT Vision product families, with equipment photos, model information and 2026 brochures.

TT Vision wirebond inspection for wire, die and epoxy defects, including 3D profiling and bond and loop measurements.
Explore F241/F4X wirebond AOI →
TT Vision F2X Pro, Pro+ and S3i cover wafer surface inspection, 3D bump metrology and subsurface micro-crack inspection.
Explore the F2X wafer AOI series →Connection requirements for cooling distribution units and server liquid-cooling circuits.
Explore the application →Vacuum connections and precision inspection requirements for semiconductor and other manufacturing environments.
Explore the application →Share your application, drawings and technical requirements.